Shanghai, China · Since 2020
SHIYI has developed two core technology platforms for precision and heavy-duty cutting: electroplated precision diamond wire saws and laser-welded diamond wire ropes.
Precision diamond wire saw and diamond wire rope manufacturing
24-wire electroplating technology and laser-welded bead production
Precision and heavy-duty cutting products on dedicated production tracks
Product Lines
From precision hard-and-brittle material cutting to heavy-duty stone and engineering applications, SHIYI operates two dedicated product and technology tracks.
Precision Cutting Platform
Electroplated diamond wire technology for photovoltaic silicon wafers, semiconductor wafers, sapphire, optical glass and magnetic materials.
Heavy-Duty Cutting Platform
Laser-welded diamond bead technology for stone quarrying, slab processing, shaped cutting and reinforced concrete demolition.
Live Product Catalog
Dual-Track Integrated Manufacturing
Dedicated equipment, processes, formulations and production systems support both core product lines.
Precision Wire Saw
Self-developed 24-wire electroplating production line, the first of its kind in China.
Diamond Wire Rope
Automatic laser-welding equipment and fully automatic bead injection-molding production lines.
Precision Wire Saw
Proprietary micro-cluster abrasive coating plus a three-layer composite coating for uniform abrasive distribution and batch-to-batch consistency.
Diamond Wire Rope
Laser-sealed welded diamond beads with rubber, spring or injection-molded fixing for bead retention and impact resistance.
Precision Wire Saw
An independent materials laboratory develops electroplating formulations for different hard and brittle materials.
Diamond Wire Rope
A diamond formulation laboratory develops dedicated bead matrices for marble, granite, basalt and reinforced concrete.
Precision Wire Saw
Precision diamond wire saw capacity: 1,000,000 km/month.
Diamond Wire Rope
Diamond wire rope capacity: 1,000,000 m/month.
Dual-Track Core Technology
Independent materials and diamond formulation laboratories support electroplated precision wire and laser-welded diamond wire rope through their distinct equipment, processes and formulations.
Precision Diamond Wire Saw
φ24–φ580 μm · 1,000,000 km/month
Precision Diamond Wire Saw
Photovoltaic · Semiconductor · Sapphire
High-Performance Diamond Wire Rope
Φ4.3–Φ12.5 mm · 1,000,000 m/month
High-Performance Diamond Wire Rope
More than 20% higher cutting life under comparable conditions
10+ invention and utility model patents covering coating structures, tension control, conductive systems and bead-welding structures.
Application Solutions
Precision diamond wire saws serve photovoltaic, semiconductor and brittle-material processing; diamond wire ropes serve stone processing and reinforced concrete demolition.
01 / 05
Traditional slurry cutting creates wider kerfs, resulting in higher silicon loss and lower material utilization.
SHIYI's proprietary micro-cluster abrasive coating process provides stronger and more stable cutting performance at comparable wire diameters.
Overall slicing yield improved by approximately 1.5%–1.6%.
Full application detail02 / 05
Semiconductor and sapphire materials are hard and brittle, making them vulnerable to surface damage during conventional processing.
High-precision electroplating precisely controls diamond particle distribution and coating bonding strength.
Improved cutting surface quality and final wafer yield.
Full application detail03 / 05
Sapphire and optical glass are hard and brittle, making them prone to edge chipping and microcracks.
The micro-cluster abrasive coating process precisely controls abrasive distribution and cutting behavior to reduce cutting stress.
Reduced surface damage and improved finished-product yield.
Full application detail04 / 05
Reinforcing bar impacts the beads heavily, cracking them or stripping the abrasive layer.
A dedicated reinforced-concrete bead formulation balances cutting speed and impact resistance.
Stable cutting efficiency in reinforced structures.
Full application detail05 / 05
Wide saw kerfs reduce recovery from high-value stone blocks.
Controlled bead diameter supports a narrow kerf and flat cut face.
Narrower kerf improves stone-block recovery.
Full application detailPerformance Evidence
The original comparison records pure A-grade yield and related cutting results from two customer trials.
OEM / ODM & Technical Support
Free product selection and dual-track technical support match each product configuration to the material, equipment and working conditions.
Diamond Wire Saw
Wire diameter, diamond concentration, coating thickness, spool length, packaging and customer branding.
High-Performance Diamond Wire Rope
Beads per meter, rope diameter, single-rope length, bead formulation and rubber, spring or injection-molded fixing.
Please provide your materials, equipment model, and current cutting parameters so we can provide specification suggestions free of charge. We can arrange sample trials, and the sample fee can be credited toward bulk orders meeting the standard Minimum Order Quantity.
Technical Enquiry
Our engineering team provides free product selection support for precision wafer cutting and heavy-duty stone or concrete applications, with OEM / ODM customization available.
Sample fees can be credited toward bulk orders meeting the standard MOQ. Our technical team will respond within 24 hours. About our technical service
