Dual-Track Manufacturing:Precision Diamond Wire Saw & High-Performance Diamond Wire Rope

Industry Problem

• Traditional slurry cutting creates wider kerfs, resulting in higher silicon loss and lower material utilization.
• Unstable cutting yield and inconsistent finished products directly affect downstream production yield.
• As wire diameter decreases, conventional wire products may become unstable or break, reducing cutting accuracy and interrupting production.

Our Approach

• SHIYI's proprietary micro-cluster abrasive coating process provides stronger and more stable cutting performance at comparable wire diameters.
• Self-developed high-speed electroplating equipment combined with patented tension-control technology helps maintain stable production.
• A full-process quality management system covers raw materials, production and final inspection.

Measured Value

• Overall slicing yield improved by approximately 1.5%–1.6%.
• Narrower kerf and improved material utilization.
• Trusted by leading customers across multiple industries worldwide.

Industry Problem

• Semiconductor and sapphire materials are hard and brittle, making them vulnerable to surface damage during conventional processing.
• High-precision manufacturing requires strict cutting accuracy and thickness uniformity.
• Unstable cutting quality increases downstream processing costs and affects continuous production efficiency.

Our Approach

• High-precision electroplating precisely controls diamond particle distribution and coating bonding strength.
• Wire design is optimized for precision applications to reduce cutting stress and material damage.
• Strict process control and final inspection help maintain cutting accuracy and batch consistency.

Measured Value

• Improved cutting surface quality and final wafer yield.
• Reduced downstream processing and lower overall manufacturing cost.
• Monthly capacity up to 1,000,000 km.

Industry Problem

• Sapphire and optical glass are hard and brittle, making them prone to edge chipping and microcracks.
• A deep damaged layer significantly increases downstream grinding and polishing costs and may result in scrapped workpieces.
• Conventional cutting creates wider kerfs and high material loss when processing valuable materials.

Our Approach

• The micro-cluster abrasive coating process precisely controls abrasive distribution and cutting behavior to reduce cutting stress.
• Optimized coating bonding improves abrasive retention and cutting stability.
• 200–450 μm wire specifications are matched to sapphire and precision-material cutting requirements.

Measured Value

• Reduced surface damage and improved finished-product yield.
• Reduced grinding and polishing workload and lower total processing cost.
• Lower kerf loss and improved utilization of high-value materials.

Industry Problem

• Reinforcing bar impacts the beads heavily, cracking them or stripping the abrasive layer.
• Conventional rope saws lose cutting speed sharply in reinforced structures, extending the schedule.

Our Approach

• A dedicated reinforced-concrete bead formulation balances cutting speed and impact resistance.
• Laser-welded beads and application-specific fixing improve bead retention under impact.

Measured Value

• Stable cutting efficiency in reinforced structures.
• Fewer bead failures and rope changes support faster project progress.

Industry Problem

• Wide saw kerfs reduce recovery from high-value stone blocks.
• Fast bead wear and short rope life create frequent changes and costly downtime.
• Different stone types require dedicated formulations for stable cutting efficiency.

Our Approach

• Controlled bead diameter supports a narrow kerf and flat cut face.
• Laser-welded beads on an aviation-grade steel cable core deliver strong bead retention.
• Dedicated formulations are available for marble, granite, basalt and reinforced concrete.

Measured Value

• Narrower kerf improves stone-block recovery.
• Under comparable working conditions, cutting life is more than 20% higher than common industry products.
• Customization covers beads per meter, rope diameter, rope length, formulation and fixing method.