Shanghai Shiyi Industrial Co., Ltd.

Product Line

Precision Diamond Wire Saw

Electroplated diamond wire technology for photovoltaic silicon wafers, semiconductor wafers, sapphire, optical glass and magnetic materials.

Core Technology

  • Self-developed 24-wire electroplating line
  • Proprietary micro-cluster abrasive coating
  • Three-layer composite coating
Product-Line Range
φ24–φ580 μm
Monthly Capacity
1,000,000 km/month

Applications

  • Photovoltaic silicon wafers
  • Semiconductor wafers
  • Sapphire
  • Optical glass
  • Magnetic materials

Customization

  • Wire diameter
  • Diamond concentration
  • Coating thickness
  • Spool length
  • Packaging and branding
Diamond Wire Saw (Precision Cutting) — view 1

4 products

Products in this line

Closed-Loop Carbon Steel Diamond Wire (0.33-0.78mm)

Closed-Loop Carbon Steel Diamond Wire (0.33-0.78mm)

A closed-loop diamond wire specifically designed for cutting large or irregularly shaped materials such as stone blocks, honeycomb materials and building components. Featuring a high-strength carbon steel core reinforced by specialised welding and plating, it offers exceptional breaking strength and a long service life, making it suitable for heavy-duty applications such as quarrying and stone processing.

Extremely high load capacity
High breaking strength, suitable for cutting under high tension and with high feed rates.
Closed-loop design
No wear at the joints, smooth operation, and reduced risk of wire breakage.
High durability
Reinforced with a coating for a long service life, suitable for continuous operation.
Flexible customisation
Circumference can be customised to meet customer requirements, making it compatible with cutting equipment of various sizes.
View Details
Fine Carbon Steel Diamond Wire (34-60μm)

Fine Carbon Steel Diamond Wire (34-60μm)

A cost-effective diamond wire suitable for cutting photovoltaic silicon wafers (210 mm/182 mm), semiconductor wafers and general hard, brittle materials. Featuring a high-carbon cold-drawn steel core and a three-layer composite coating, it is produced using a well-established process and is available with consistent supply. Offering a cost advantage whilst ensuring cutting quality, it is the mainstay product for routine slicing.

Excellent mechanical properties
tensile strength ≥ 3,000–4,500 MPa (higher for finer wires), breaking force ≥ 10 N (φ78 μm).
Precision tolerances
wire diameter tolerance ±0.6–1.0 μm, ovality ≤ 1.2 μm.
Low damage
Front-side chipping ≤ 3–5 μm, rear-side chipping ≤ 5–8 μm, damage layer ≤ 8–12 μm (for semiconductor applications).
Wide compatibility
Compatible with mainstream cutting equipment
View Details
Medium-Coarse to Coarse Carbon Steel Diamond Wire (77-580μm)

Medium-Coarse to Coarse Carbon Steel Diamond Wire (77-580μm)

Medium-coarse to coarse-diameter diamond wires specifically designed for cutting medium-to-thick, hard and brittle materials such as sapphire, ceramics, quartz, magnetic materials and stone. Featuring a high-carbon cold-drawn steel wire core and a three-layer composite plating process, these wires offer a wide range of diameters (77–580 μm) and high breaking strength, making them suitable for high-feed, high-load cutting conditions whilst balancing cutting efficiency with surface quality. Coarse wire specifications of 245 μm and above can be customised to meet diverse machining requirements.

1. High breaking strength
The thicker the wire diameter, the higher the breaking strength (φ78 μm ≥ 10 N → φ245 μm ≥ 50 N; for custom specifications of thicker wires, the breaking strength increases proportionally), ensuring the wire does not break during high-feed cutting.
2. Robust coating
Bond strength ≥ 30 MPa, coating hardness 450–580 HV, excellent wear resistance, suitable for continuous cutting under high loads.
3. Wide tolerance control
Wire diameter tolerance ranges from ±1.5–3.0 μm (77–200 μm) to ±3.0–5.0 μm (200–580 μm), with ovality ≤ 1.8 μm.
4. High versatility
Suitable for a wide range of hard and brittle materials; concentration and length can be flexibly adjusted.
View Details
Ultra-Fine Tungsten Core Diamond Wire (24-32μm)

Ultra-Fine Tungsten Core Diamond Wire (24-32μm)

A high-end diamond wire specifically designed for cutting 8–12-inch semiconductor wafers, SiC, GaN and ultra-thin wafers of ≤75 μm. Featuring a tungsten or tungsten-lanthanum alloy core combined with a three-layer composite plating process, it offers extremely high tensile strength, an extremely low breakage rate and excellent cutting precision, meeting the requirements for semiconductor-grade high cleanliness and ultra-low damage.

Ultra-high strength
Tensile strength ≥ 3000–3200 MPa (tungsten alloys can reach ≥ 6000 MPa), ensuring no deformation during high-speed cutting.
Extremely low damage
Front-side chipping ≤ 2–3 μm, rear-side chipping ≤ 3–5 μm, damage layer ≤ 7–10 μm (depending on the material).
Precision tolerances
Wire diameter tolerance ±2.0 μm, ovality ≤ 1.0 μm
Long service life
Service life for semiconductor cutting ≥ 240 km per roll, with a yield rate 0.68%–2.35% higher than that of mainstream products.
View Details

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Technical Enquiry

Discuss Your Cutting or Production Requirement

Our engineering team provides free product selection support for precision wafer cutting and heavy-duty stone or concrete applications, with OEM / ODM customization available.

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Email
siying@shiyi-industrial.net
WhatsApp
+86 173 2112 4971
Phone
+86 133 1171 5971

Sample fees can be credited toward bulk orders meeting the standard MOQ. Our technical team will respond within 24 hours. About our technical service