Diamond Wire Saw (Precision Cutting)

Medium-Coarse to Coarse Carbon Steel Diamond Wire (77-580μm)

Medium-coarse to coarse-diameter diamond wires specifically designed for cutting medium-to-thick, hard and brittle materials such as sapphire, ceramics, quartz, magnetic materials and stone. Featuring a high-carbon cold-drawn steel wire core and a three-layer composite plating process, these wires offer a wide range of diameters (77–580 μm) and high breaking strength, making them suitable for high-feed, high-load cutting conditions whilst balancing cutting efficiency with surface quality. Coarse wire specifications of 245 μm and above can be customised to meet diverse machining requirements.

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Overview

Product overview

1. Base material: high-carbon steel (C ≥ 0.8 per cent); busbar diameters range from approximately 60 μm to 500 μm, with finished outer diameters ranging from 77 to 580 μm. 2. Coating structure: Pre-plated nickel undercoat (2.0–3.0 μm) + diamond grit + thickened nickel-cobalt alloy layer (0.5–8 μm); total coating thickness 3.0–20.0 μm (increasing with wire diameter). 3. Diamond concentration: 60–160 grains/mm (customisable). 4. Standard stock specifications: 78 μm, 90 μm, 102 μm, 125 μm, 148 μm, 170 μm, 195 μm, 220 μm, 245 μm. 5. Extended custom specifications: 245 μm and above up to 580 μm (including 300 μm, 350 μm, 400 μm, 580 μm, etc.); process parameters are the same as the standard series, with wire diameter, concentration and length customisable as required. 6. Typical applications: sapphire substrates, optical glass, ceramic substrates, quartz crucibles, permanent magnet materials, engineered stone, etc. 7. Customisable items: wire diameter, diamond concentration (60–160 grains per mm), coating thickness, spool length (60/120/240 km) and packaging

Features

Key features and parameters

Technical specifications
Specification	Value
1. High breaking strength	The thicker the wire diameter, the higher the breaking strength (φ78 μm ≥ 10 N → φ245 μm ≥ 50 N; for custom specifications of thicker wires, the breaking strength increases proportionally), ensuring the wire does not break during high-feed cutting.
2. Robust coating	Bond strength ≥ 30 MPa, coating hardness 450–580 HV, excellent wear resistance, suitable for continuous cutting under high loads.
3. Wide tolerance control	Wire diameter tolerance ranges from ±1.5–3.0 μm (77–200 μm) to ±3.0–5.0 μm (200–580 μm), with ovality ≤ 1.8 μm.
4. High versatility	Suitable for a wide range of hard and brittle materials; concentration and length can be flexibly adjusted.
5. Consistent cutting quality	controllable chipping; smooth cross-section.
6. Comprehensive product range	Covers the full spectrum from fine and medium-coarse to heavy-duty coarse wires, meeting the cutting requirements for materials of varying thicknesses and hardnesses.

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Closed-Loop Carbon Steel Diamond Wire (0.33-0.78mm)

A closed-loop diamond wire specifically designed for cutting large or irregularly shaped materials such as stone blocks, honeycomb materials and building components. Featuring a high-strength carbon steel core reinforced by specialised welding and plating, it offers exceptional breaking strength and a long service life, making it suitable for heavy-duty applications such as quarrying and stone processing.

Extremely high load capacity: High breaking strength, suitable for cutting under high tension and with high feed rates.
Closed-loop design: No wear at the joints, smooth operation, and reduced risk of wire breakage.
High durability: Reinforced with a coating for a long service life, suitable for continuous operation.
Flexible customisation: Circumference can be customised to meet customer requirements, making it compatible with cutting equipment of various sizes.

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Fine Carbon Steel Diamond Wire (34-60μm)

A cost-effective diamond wire suitable for cutting photovoltaic silicon wafers (210 mm/182 mm), semiconductor wafers and general hard, brittle materials. Featuring a high-carbon cold-drawn steel core and a three-layer composite coating, it is produced using a well-established process and is available with consistent supply. Offering a cost advantage whilst ensuring cutting quality, it is the mainstay product for routine slicing.

Excellent mechanical properties: tensile strength ≥ 3,000–4,500 MPa (higher for finer wires), breaking force ≥ 10 N (φ78 μm).
Precision tolerances: wire diameter tolerance ±0.6–1.0 μm, ovality ≤ 1.2 μm.
Low damage: Front-side chipping ≤ 3–5 μm, rear-side chipping ≤ 5–8 μm, damage layer ≤ 8–12 μm (for semiconductor applications).
Wide compatibility: Compatible with mainstream cutting equipment

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Ultra-Fine Tungsten Core Diamond Wire (24-32μm)

A high-end diamond wire specifically designed for cutting 8–12-inch semiconductor wafers, SiC, GaN and ultra-thin wafers of ≤75 μm. Featuring a tungsten or tungsten-lanthanum alloy core combined with a three-layer composite plating process, it offers extremely high tensile strength, an extremely low breakage rate and excellent cutting precision, meeting the requirements for semiconductor-grade high cleanliness and ultra-low damage.

Ultra-high strength: Tensile strength ≥ 3000–3200 MPa (tungsten alloys can reach ≥ 6000 MPa), ensuring no deformation during high-speed cutting.
Extremely low damage: Front-side chipping ≤ 2–3 μm, rear-side chipping ≤ 3–5 μm, damage layer ≤ 7–10 μm (depending on the material).
Precision tolerances: Wire diameter tolerance ±2.0 μm, ovality ≤ 1.0 μm
Long service life: Service life for semiconductor cutting ≥ 240 km per roll, with a yield rate 0.68%–2.35% higher than that of mainstream products.

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Technical Enquiry

Discuss Your Cutting or Production Requirement

Our engineering team provides free product selection support for precision wafer cutting and heavy-duty stone or concrete applications, with OEM / ODM customization available.

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Email: siying@shiyi-industrial.net
WhatsApp: +86 173 2112 4971
Phone: +86 133 1171 5971

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