Diamond Wire Saw (Precision Cutting)

Closed-Loop Carbon Steel Diamond Wire (0.33-0.78mm)

A closed-loop diamond wire specifically designed for cutting large or irregularly shaped materials such as stone blocks, honeycomb materials and building components. Featuring a high-strength carbon steel core reinforced by specialised welding and plating, it offers exceptional breaking strength and a long service life, making it suitable for heavy-duty applications such as quarrying and stone processing.

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Overview

Product overview

1. Base material: High-carbon steel busbar, diameters ranging from 0.25 to 0.65 mm, etc., with a finished outer diameter of 0.33 to 0.78 mm (tolerance ±0.03 to 0.04 mm). 2. Breaking strength: ≥90 N (0.25 mm busbar) to ≥280 N (0.65 mm busbar). 3. Structure: Closed-loop welding + reinforced coating; coating hardness 450–580 HV. 4. Typical applications: Cutting of rough stone blocks such as granite, marble and sandstone; machining of irregularly shaped materials such as honeycomb ceramics and foam metals. 5. Customisation services: Customisable circumference (single or multi-ring), diamond concentration and packaging.

Features

Key features and parameters

Technical specifications
Specification	Value
Extremely high load capacity	High breaking strength, suitable for cutting under high tension and with high feed rates.
Closed-loop design	No wear at the joints, smooth operation, and reduced risk of wire breakage.
High durability	Reinforced with a coating for a long service life, suitable for continuous operation.
Flexible customisation	Circumference can be customised to meet customer requirements, making it compatible with cutting equipment of various sizes.

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Fine Carbon Steel Diamond Wire (34-60μm)

A cost-effective diamond wire suitable for cutting photovoltaic silicon wafers (210 mm/182 mm), semiconductor wafers and general hard, brittle materials. Featuring a high-carbon cold-drawn steel core and a three-layer composite coating, it is produced using a well-established process and is available with consistent supply. Offering a cost advantage whilst ensuring cutting quality, it is the mainstay product for routine slicing.

Excellent mechanical properties: tensile strength ≥ 3,000–4,500 MPa (higher for finer wires), breaking force ≥ 10 N (φ78 μm).
Precision tolerances: wire diameter tolerance ±0.6–1.0 μm, ovality ≤ 1.2 μm.
Low damage: Front-side chipping ≤ 3–5 μm, rear-side chipping ≤ 5–8 μm, damage layer ≤ 8–12 μm (for semiconductor applications).
Wide compatibility: Compatible with mainstream cutting equipment

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Medium-Coarse to Coarse Carbon Steel Diamond Wire (77-580μm)

Medium-coarse to coarse-diameter diamond wires specifically designed for cutting medium-to-thick, hard and brittle materials such as sapphire, ceramics, quartz, magnetic materials and stone. Featuring a high-carbon cold-drawn steel wire core and a three-layer composite plating process, these wires offer a wide range of diameters (77–580 μm) and high breaking strength, making them suitable for high-feed, high-load cutting conditions whilst balancing cutting efficiency with surface quality. Coarse wire specifications of 245 μm and above can be customised to meet diverse machining requirements.

1. High breaking strength: The thicker the wire diameter, the higher the breaking strength (φ78 μm ≥ 10 N → φ245 μm ≥ 50 N; for custom specifications of thicker wires, the breaking strength increases proportionally), ensuring the wire does not break during high-feed cutting.
2. Robust coating: Bond strength ≥ 30 MPa, coating hardness 450–580 HV, excellent wear resistance, suitable for continuous cutting under high loads.
3. Wide tolerance control: Wire diameter tolerance ranges from ±1.5–3.0 μm (77–200 μm) to ±3.0–5.0 μm (200–580 μm), with ovality ≤ 1.8 μm.
4. High versatility: Suitable for a wide range of hard and brittle materials; concentration and length can be flexibly adjusted.

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Ultra-Fine Tungsten Core Diamond Wire (24-32μm)

A high-end diamond wire specifically designed for cutting 8–12-inch semiconductor wafers, SiC, GaN and ultra-thin wafers of ≤75 μm. Featuring a tungsten or tungsten-lanthanum alloy core combined with a three-layer composite plating process, it offers extremely high tensile strength, an extremely low breakage rate and excellent cutting precision, meeting the requirements for semiconductor-grade high cleanliness and ultra-low damage.

Ultra-high strength: Tensile strength ≥ 3000–3200 MPa (tungsten alloys can reach ≥ 6000 MPa), ensuring no deformation during high-speed cutting.
Extremely low damage: Front-side chipping ≤ 2–3 μm, rear-side chipping ≤ 3–5 μm, damage layer ≤ 7–10 μm (depending on the material).
Precision tolerances: Wire diameter tolerance ±2.0 μm, ovality ≤ 1.0 μm
Long service life: Service life for semiconductor cutting ≥ 240 km per roll, with a yield rate 0.68%–2.35% higher than that of mainstream products.

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Technical Enquiry

Discuss Your Cutting or Production Requirement

Our engineering team provides free product selection support for precision wafer cutting and heavy-duty stone or concrete applications, with OEM / ODM customization available.

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Email: siying@shiyi-industrial.net
WhatsApp: +86 173 2112 4971
Phone: +86 133 1171 5971

Sample fees can be credited toward bulk orders meeting the standard MOQ. Our technical team will respond within 24 hours. About our technical service