Cutting Equipment
SDRQ241-3055L Multi-Wire Cutting Machine
4‑spindle high‑capacity multi‑wire cutting machine designed for efficient slicing of PV silicon ingots, semiconductor crystal ingots, sapphire, SiC and other hard‑brittle materials – ideal for large‑scale production.
Overview
Product overview
1. 4 powerful spindles with high‑precision rollers and precise tension control system for excellent cutting stability. 2. Water‑cooled cutting ensures low temperature rise and maintains wafer surface quality. 3. Supports rod slicing up to Φ300mm×550mm; max cutting speed up to 1500m/min. 4. Robust machine construction with 74KW full load power – suitable for continuous high‑volume production.
Specification
Technical specification
| Specification | Value |
|---|---|
| Model | SDRQ241-3055L |
| Number of spindles | 4 |
| Number of stations | 1 |
| Roller size | Φ160mm×550mm |
| Roller center distance | 480mm |
| Workplate size | 300mm×550mm×20mm |
| Max workpiece size | Φ300mm×550mm (rod) |
| Cooling type | Water‑cooled |
| Max cutting speed | ≤1500m/min |
| Machine dimensions | 2360×2610×2410mm (H) |
| Max height | 3640mm |
| Machine weight | approx. 7500KG |
| Spindle power | 15KW×4 |
| Tension motor | 2.9KW×2 |
| Wire pay‑off/rewind motor | 2.9KW×2 |
| Full load power | 74KW |
Technical Enquiry
Discuss Your Cutting or Production Requirement
Our engineering team provides free product selection support for precision wafer cutting and heavy-duty stone or concrete applications, with OEM / ODM customization available.
- +86 173 2112 4971
- Phone
- +86 133 1171 5971
Sample fees can be credited toward bulk orders meeting the standard MOQ. Our technical team will respond within 24 hours. About our technical service